Real-time measurement of the shrinkage rate and shrinkage stress of UV-curable and thermosetting resins. It measures the volume change from before curing to after curing.
The "CUSTRON" resin curing shrinkage stress measurement device continuously measures the curing shrinkage rate and shrinkage stress associated with the curing of UV-curable resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, and more. It allows for the flexible combination and setting of thermal profiles, such as heating, cooling, and UV irradiation, through programming. It reproduces the shrinkage rates and shrinkage stresses that products experience under various thermal conditions during the manufacturing process or when subjected to different environments over time.
【We have received positive feedback from customers like these】
● It is groundbreaking because there has been no method for continuous measurement of resin shrinkage rates until now (currently, shrinkage rates are confirmed by measuring the shrinkage of the resin after curing).
● I was looking for a device that could perform continuous measurements, and I finally found it.
● It is helpful that I can use it on a spot basis without having to purchase the device.
● There is a sense of security because on-site measurements can also be conducted.
● It is more cost-effective than requesting analysis from other centers.
【Are you facing any of these issues?】
● I want to smoothly verify the optimal curing conditions when using resin.
● Relying solely on destructive testing for verification is time-consuming and costly, leading to poor productivity.
